Thermal Deformation Analysis of Electronic Packaging by Viscoplastic Constitutive Model (Comparison of Lead Solder Alloys with Lead-Free Solder Alloys)
YANAGIMOTO, Akiyuki, SASAKI, Katsuhiko, ISHIKAWA, HiromasaVolume:
70
Year:
2004
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.70.147
File:
PDF, 1013 KB
2004