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Influences of Microstructure and Specimen Size on Creep Properties of Solders
KOHKETSU, Hideyuki, TAKAHASHI, Kyouhei, OGAWA, Takeshi, OHSAWA, TadashiVolume:
71
Year:
2005
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.71.1684
File:
PDF, 1.20 MB
2005