Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package
KIM, YoungBae, NOGUCHI, Hiroshi, AMAGAI, MasazumiVolume:
72
Year:
2006
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.72.186
File:
PDF, 2.44 MB
2006