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A new system of sensing film thickness by use of thermal conduction.
KAWAI, Hideki, KOHNO, Kimihiko, TANAHASHI, Takahiko, ANDO, TsuneyoVolume:
52
Year:
1986
Journal:
Transactions of the Japan Society of Mechanical Engineers Series C
DOI:
10.1299/kikaic.52.2671
File:
PDF, 982 KB
1986