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High-efficiency planarization method combining mechanical polishing and atmospheric-pressure plasma etching for hard-to-machine semiconductor substrates
SANO, Yasuhisa, SHIOZAWA, Kousuke, DOI, Toshiro, KUROKAWA, Syuhei, AIDA, Hideo, MIYASHITA, Tadakazu, YAMAUCHI, KazutoVolume:
3
Year:
2016
Language:
english
Journal:
Mechanical Engineering Journal
DOI:
10.1299/mej.15-00527
File:
PDF, 1.33 MB
english, 2016