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High aspect ratio grooving of Si using a wet etching assisted by wire-friction (A feasibility study for the applicaiotn for slicing Si ingots)
MURATA, Junji, TSUCHIDA, Takeshi, TANI, Yasuhiro, ZHANG, YuVolume:
80
Year:
2014
Language:
english
Journal:
Transactions of the JSME (in Japanese)
DOI:
10.1299/transjsme.2014smm0183
File:
PDF, 2.08 MB
english, 2014