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Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC)
Wang, Fengjuan, Yu, NingmeiVolume:
13
Year:
2016
Language:
english
Journal:
IEICE Electronics Express
DOI:
10.1587/elex.13.20151117
File:
PDF, 926 KB
english, 2016