[IEEE 2016 12th International Congress Molded Interconnect...

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[IEEE 2016 12th International Congress Molded Interconnect Devices (MID) - Wuerzburg, Germany (2016.9.28-2016.9.29)] 2016 12th International Congress Molded Interconnect Devices (MID) - Curcuit board application to additive manufactured components by laser-direct-structuring

Gath, Christian, Drummer, Dietmar
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Year:
2016
Language:
english
DOI:
10.1109/icmid.2016.7738926
File:
PDF, 3.58 MB
english, 2016
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