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Enhancement of Seeding and Electroless Cu Plating on TaN Barrier Layers: The Role of Plasma Functionalized Self-Assembled Monolayers
Chen, Giin-Shan, Wu, Ding-Ye, Chen, Sung-Te, Cheng, Yi-Lung, Fang, Jau-Shiung, Yang, Tzu-MingVolume:
163
Year:
2016
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.0131609jes
File:
PDF, 1.19 MB
english, 2016