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Accurate Measurement of Temperature-Dependent Warpage Distribution of Electronic Packaging Using FLCOS-Based Fringe Projection Profilometry
RI, Shien, MURAMATSU, Takashi, SAKA, Masumi, TANAKA, Hiroyuki, OKABE, Yukihiro, SUZUKI, HiroshiVolume:
6
Year:
2012
Language:
english
Journal:
Journal of Solid Mechanics and Materials Engineering
DOI:
10.1299/jmmp.6.721
File:
PDF, 2.39 MB
english, 2012