Enhancing Electromigration Resistance of Sn1Ag0.5Cu Solder...

Journal of Solid Mechanics and Materials Engineering 2013 Vol. 7; Iss. 1

Enhancing Electromigration Resistance of Sn1Ag0.5Cu Solder by Adding Single Ni or Ge Microelement

ZHAO, Xu, SAKA, Masumi, YAMASHITA, Mitsuo, HOKAZONO, Hiroaki
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Volume:
7
Year:
2013
Language:
english
Journal:
Journal of Solid Mechanics and Materials Engineering
DOI:
10.1299/jmmp.7.118
File:
PDF, 3.90 MB
english, 2013
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