Fatigue Strength of BGA Type Solder Joints between Package...

JSME International Journal Series A 2006 Vol. 49; Iss. 2

Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

NAGANO, Kohta, YAGUCHI, Akihiro, TERASAKI, Takeshi, YAMAMOTO, Kenichi
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Volume:
49
Year:
2006
Language:
english
Journal:
JSME International Journal Series A
DOI:
10.1299/jsmea.49.220
File:
PDF, 1.86 MB
english, 2006
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