Thermal fatigue strength estimation of solder joints of...

Thermal fatigue strength estimation of solder joints of surface mount IC packages. 2nd Report; Comparison of three types of leads.

KITANO, Makoto, KAWAI, Sueo, SHIMIZU, Ichio
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Volume:
56
Year:
1990
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.56.1140
File:
PDF, 718 KB
1990
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