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Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages under Temperature Cycling.
MIURA, Hideo, KITANO, Makoto, NISHIMURA, Asao, KAWAI, Sueo, NISHI, KunihikoVolume:
57
Year:
1991
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.57.2415
File:
PDF, 659 KB
1991