Evaluation of Photoresist Image Adhesion Strength Using the...

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 1997 Vol. 63; Iss. 607

Evaluation of Photoresist Image Adhesion Strength Using the Surface Roughness Factor(SRF) of Copper Substrate.

SAKATA, Sohji, HATSUDA, Toshio, KAWABE, Akihiro, OHNO, Hiromitsu, HIROHATA, Yuko, YAMASHINA, Toshiro
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Volume:
63
Year:
1997
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.63.643
File:
PDF, 987 KB
1997
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