Thermoelastic Analysis of the Stress Distribution Near the...

Thermoelastic Analysis of the Stress Distribution Near the Edge of the Interface between the Superconductive Thin Film and its Substrate. Application of a Boundary Element Method Using Fundamental Solution of Dissimilar Materials.

TAKAHASHI, Mamoru, SHIBUYA, Yotsugi
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Volume:
64
Year:
1998
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.64.1890
File:
PDF, 565 KB
1998
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