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A Method for Introducing Pre-Crack along Interface between Submicron-Thick Film and Substrate.
KITAMURA, Takayuki, HIRAKATA, Hiroyuki, KUSANO, TakatoVolume:
69
Year:
2003
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.69.610
File:
PDF, 881 KB
2003