3-Dimensional Elastic-Plastic Finite Element Analysis of Stress-Induced Voiding in Cu Damascene Interconnects of Ultra-Large-Scale Integrated Circuits
SAITOH, Takehiro, KAWANO, Masaya, UENO, KazuyoshiVolume:
69
Year:
2003
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.69.964
File:
PDF, 960 KB
2003