Damage Path Simulation of Solder Bumps Under Mechanical Fatigue Tests
MUKAI, Minoru, MONDA, Tomoko, HIROHATA, Kenji, TAKAHASHI, Hiroyuki, KAWAKAMI, TakashiVolume:
73
Year:
2007
Language:
english
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.73.1431
File:
PDF, 1.09 MB
english, 2007