Mechanism of Warpage Increase Behavior Induced by Thermal...

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 2011 Vol. 77; Iss. 773

Mechanism of Warpage Increase Behavior Induced by Thermal Cycling in Semiconductor Package

FUJIMOTO, Yasuhisa, SATO, Mitsuru, SAKAMOTO, Hiroo, TAKAGI, Shinichi
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Volume:
77
Year:
2011
Journal:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
DOI:
10.1299/kikaia.77.134
File:
PDF, 1.14 MB
2011
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