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Growth Mechanism and Prevention Measure of Stress-Induced Voids in Copper Interconnects
SHIMAZU, Hiromi, IWASAKI, Tomio, ISHIKAWA, Kensuke, OSHIMA, TakayukiVolume:
77
Year:
2011
Journal:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
DOI:
10.1299/kikaia.77.794
File:
PDF, 1.19 MB
2011