Evaluation of Warpage and Residual Stress in Semiconductor...

Evaluation of Warpage and Residual Stress in Semiconductor Chips Caused by the Combination of Materials in Packages

MATSUDA, Kazutoshi, IKEDA, Toru, MIYAZAKI, Noriyuki
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Volume:
78
Year:
2012
Journal:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
DOI:
10.1299/kikaia.78.1275
File:
PDF, 702 KB
2012
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