Evaluation of Warpage and Residual Stress in Semiconductor Chips Caused by the Combination of Materials in Packages
MATSUDA, Kazutoshi, IKEDA, Toru, MIYAZAKI, NoriyukiVolume:
78
Year:
2012
Journal:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
DOI:
10.1299/kikaia.78.1275
File:
PDF, 702 KB
2012