A calculation method for temperature distribution of IC...

A calculation method for temperature distribution of IC packages on a printed wiring board. (3rd Report, Temperature distribution of IC packages).

YANAGIDA, Takehiko
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Volume:
55
Year:
1989
Journal:
Transactions of the Japan Society of Mechanical Engineers Series B
DOI:
10.1299/kikaib.55.3172
File:
PDF, 761 KB
1989
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