Study of Impingement Cooling of Heat Sinks for LSI Packages with Longitudinal Fins.
KONDO, Yoshihiro, MATSUSHIMA, HitoshiVolume:
62
Year:
1996
Journal:
Transactions of the Japan Society of Mechanical Engineers Series B
DOI:
10.1299/kikaib.62.1549
File:
PDF, 783 KB
1996