Thermo-mechanical performance of Cu and SiO2 filled coaxial...

IEICE Electronics Express 2013 Vol. 10; Iss. 24

Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV)

Wang, Fengjuan, Zhu, Zhangming, Yang, Yintang, Liu, Xiaoxian, Ding, Ruixue
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Volume:
10
Year:
2013
Language:
english
Journal:
IEICE Electronics Express
DOI:
10.1587/elex.10.20130894
File:
PDF, 1.18 MB
english, 2013
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