Temperature properties of the parasitic resistance of...

IEICE Electronics Express 2014 Vol. 11; Iss. 14

Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs

Yang, Yintang, Liu, Xiaoxian, Zhu, Zhangming, Ding, Ruixue
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Volume:
11
Year:
2014
Language:
english
Journal:
IEICE Electronics Express
DOI:
10.1587/elex.11.20140504
File:
PDF, 834 KB
english, 2014
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