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Effects of Reflow Processing and Flux Residue on Ionic Migration of Lead-Free Solder Plating Using the Quartz Crystal Microbalance Method.
Tanaka, Hirokazu, Ueta, Fumitaka, Yoshihara, Sachio, Shirakashi, TakashiVolume:
42
Year:
2001
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.42.2003
File:
PDF, 1.52 MB
2001