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A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder.
Park, Chang-Bae, Hong, Soon-Min, Jung, Jae-Pil, Kang, Choon-Sik, Shin, Yong-EuiVolume:
42
Year:
2001
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.42.820
File:
PDF, 2.08 MB
2001