The Effect of Ram Speed on Mechanical and Thermal Properties in ECAE Process Simulation
Chung, Sung Wook, Kim, Woo-Jin, Kohzu, Masahide, Higashi, KenjiVolume:
44
Year:
2003
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.44.973
File:
PDF, 343 KB
english, 2003