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Sn–Cu Alloy Electrodeposition and Its Connecting Reliability for Automotive Connectors
Nakano, Hiroaki, Oue, Satoshi, Yoshihara, Daisuke, Fukushima, Hisaaki, Saka, Yoshifumi, Sawada, Shigeru, Hattori, YasuhiroVolume:
52
Year:
2011
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.m2011022
File:
PDF, 3.53 MB
english, 2011