Formation of Through-Silicon-Vias Using Pressure...

Formation of Through-Silicon-Vias Using Pressure Infiltration of Molten Tin

Kim, Min-Young, Kim, Sung-Kyu, Oh, Tae-Sung
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Volume:
53
Year:
2012
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.m2012158
File:
PDF, 2.92 MB
english, 2012
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