A Wet Process for Forming an Adhesive Copper Layer on Polyimide Film
OSAKA, Tetsuya, WAKATSUKI, Satoshi, MASUDA, Toyoto, YOSHINO, Masahiro, YAMACHIKA, Noriyuki, SASANO, Junji, MATSUDA, Itsuaki, OKINAKA, YutakaVolume:
76
Year:
2008
Language:
english
Journal:
Electrochemistry
DOI:
10.5796/electrochemistry.76.191
File:
PDF, 449 KB
english, 2008