Development of the Parametric Analysis Method of Thermal...

Development of the Parametric Analysis Method of Thermal Stress Using Homogeneous Modeling and Structural Reliability Evaluation for SOFC Module

TSURUKI, Masaki, MACHIDA, Takashi, TOKOI, Hiromi, HIWATASHI, Kenichi
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Volume:
77
Year:
2009
Journal:
Electrochemistry
DOI:
10.5796/electrochemistry.77.229
File:
PDF, 1.62 MB
2009
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