The Effect of Residual Stress on Vacancy Transportation in...

Journal of the Japan Institute of Metals 2006 Vol. 70; Iss. 12

The Effect of Residual Stress on Vacancy Transportation in Cu Interconnection due to Electromigration

Murakawa, Tutomu, Yokobori, A. Toshimitsu, Nemoto, Takenao, Miura, Hideo
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Volume:
70
Year:
2006
Journal:
Journal of the Japan Institute of Metals
DOI:
10.2320/jinstmet.70.987
File:
PDF, 1005 KB
2006
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