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Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films
Moriyama, Miki, Konishi, Shinya, Tsukimoto, Susumu, Murakami, MasanoriVolume:
45
Year:
2004
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.45.3172
File:
PDF, 205 KB
english, 2004