Influence of Bonding Condition on Bonding Process Using Ag...

Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging

Ide, Eiichi, Hirose, Akio, Kobayashi, Kojiro F.
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Volume:
47
Year:
2006
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.47.211
File:
PDF, 523 KB
english, 2006
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