Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging
Ide, Eiichi, Hirose, Akio, Kobayashi, Kojiro F.Volume:
47
Year:
2006
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.47.211
File:
PDF, 523 KB
english, 2006