Bonding Technique Using Micro-Scaled Silver-Oxide Particles...

Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles

Morita, Toshiaki, Yasuda, Yusuke, Ide, Eiichi, Akada, Yusuke, Hirose, Akio
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Volume:
49
Year:
2008
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.mra2008269
File:
PDF, 274 KB
english, 2008
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