[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Vapor chamber forced convection cooling using flow boiling in open microchannels and tapered manifolds
Buchling, Philipp K., Kandlikar, Satish G.Year:
2016
Language:
english
DOI:
10.1109/itherm.2016.7517597
File:
PDF, 509 KB
english, 2016