Effect of Ni or Co Addition to Sn-Ag Solder on...

MATERIALS TRANSACTIONS 2008 Vol. 49; Iss. 7

Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface

Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
49
Year:
2008
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.mf200851
File:
PDF, 315 KB
english, 2008
Conversion to is in progress
Conversion to is failed