Interfacial Reaction Layer and Reliability of CSP Solder...

Journal of the Japan Institute of Metals 2005 Vol. 69; Iss. 1

Interfacial Reaction Layer and Reliability of CSP Solder Joints using Sn-8Zn-3Bi Solder and Ni/Au Plating Pad

Yamaguchi, Atsushi, Furusawa, Akio, Nishida, Kazuto, Iwanishi, Hiroaki, Hojo, Takashi, Sogo, Yosuke, Hirose, Akio, Kobayashi, Kojiro F.
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Volume:
69
Year:
2005
Journal:
Journal of the Japan Institute of Metals
DOI:
10.2320/jinstmet.69.132
File:
PDF, 624 KB
2005
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