Influence of the Interfacial Reaction Layer on Reliability...

MATERIALS TRANSACTIONS 2004 Vol. 45; Iss. 3

Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating

Sogo, Yousuke, Hojo, Takashi, Iwanishi, Hiroaki, Hirose, Akio, Kobayashi, Kojiro F., Yamaguch, Atsushi, Furusawa, Akio, Nishida, Kazuto
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Volume:
45
Year:
2004
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.45.734
File:
PDF, 390 KB
english, 2004
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