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Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Kim, Dae-Gon, Jung, Seung-BooVolume:
46
Year:
2005
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.46.2366
File:
PDF, 250 KB
english, 2005