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Interfacial Reaction between Sn–Ag–Co Solder and Metals
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, TadashiVolume:
46
Year:
2005
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.46.2394
File:
PDF, 242 KB
english, 2005