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Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Takenaka, Junichi, Hagio, KoichiVolume:
46
Year:
2005
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.46.2413
File:
PDF, 406 KB
english, 2005