Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
Yim, Byung-Seung, Lee, Jeong Il, Heo, Yuseon, Kim, Jooheon, Lee, Seong Hyuk, Shin, Young-Eui, Kim, Jong-MinVolume:
53
Year:
2012
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.mb201207
File:
PDF, 6.43 MB
english, 2012