![](/img/cover-not-exists.png)
Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process
Suzuki, Kenta, Youn, Sung-Won, Park, Sang-Cheon, Hiroshima, Hiroshi, Takagi, HidekiVolume:
27
Year:
2014
Language:
english
Journal:
Journal of Photopolymer Science and Technology
DOI:
10.2494/photopolymer.27.73
File:
PDF, 628 KB
english, 2014