Analysis of Joining Boundary between Ni-P Electroless Plate...

Journal of the Japan Institute of Metals 2004 Vol. 68; Iss. 1

Analysis of Joining Boundary between Ni-P Electroless Plate and Solder by EPMA Scatter Diagram Method (I)

Kimura, Takashi, Sugizaki, Takashi, Nishida, Kenji, Ishikawa, Nobuhiro, Tanuma, Shigeo
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Volume:
68
Year:
2004
Language:
english
Journal:
Journal of the Japan Institute of Metals
DOI:
10.2320/jinstmet.68.8
File:
PDF, 988 KB
english, 2004
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