Formation of Intermetallic Phases on the Bond Interface of Aluminum-Clad Copper
Xie, Wei, Yamaguchi, Tomiko, Nishio, KazumasaVolume:
75
Year:
2011
Language:
english
Journal:
Journal of the Japan Institute of Metals
DOI:
10.2320/jinstmet.75.166
File:
PDF, 7.12 MB
english, 2011