Improvement in Thermal Reliability of a Flip Chip...

MATERIALS TRANSACTIONS 2001 Vol. 42; Iss. 5

Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps

Terashima, Shinichi, Uno, Tomohiro, Hashino, Eiji, Tatsumi, Kohei
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Volume:
42
Year:
2001
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.42.803
File:
PDF, 1.71 MB
2001
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