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Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal
Natsume, Yukinobu, Ohsasa, Kenichi, Narita, ToshioVolume:
44
Year:
2003
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.44.819
File:
PDF, 123 KB
english, 2003